IC package and LSI package using a lead frame formed of a copper

Details IC package and LSI package using a lead frame formed of a copper IC package and LSI package using a lead frame formed of a copper

1993-03-23

1994-08-23

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257761, 257766, 257762, H01L 2354, H01L 2348, H01L 2944, H01L 2952

Patent

active

053410254

ABSTRACT:
An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less is disclosed. The lead frame is, for example, obtained from an alloy that contains 0,005% by weight of sulfur or less. The lead frame has high reliability, can be produced in high yield and has high electrical conductivity.

REFERENCES:
patent: 4589930 (1986-05-01), Kumagai
patent: 4640723 (1987-02-01), Sugai et al.
patent: 4755235 (1988-07-01), Matidori et al.
patent: 5210441 (1993-05-01), Nakashima et al.

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