Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-04-19
2011-04-19
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE31117, C438S110000
Reexamination Certificate
active
07928554
ABSTRACT:
An antenna used for an ID chip or the like is disclosed with planarized antenna unevenness and an IC chip having such the antenna with a flat surface is disclosed. Manufacturing an integrated circuit mounted with an antenna is facilitated. A laminated body formed by stacking a conductive film11, a resin film13, an integrated circuit12, and a resin film14are rolled so that the resin film14is outside. Then, the laminated body is integrated in a roll form by softening the resin films13, 14by applying heat. By slicing the rolled laminated body along with the direction in which the rolled conductive film31appears in the cross section, an IC chip with antenna formed by the rolled conductive film11is formed.
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Kusumoto Naoto
Tsurume Takuya
Gordon Matthew
Le Thao X
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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