IC package pressure release apparatus and method

Details IC package pressure release apparatus and method IC package pressure release apparatus and method

2007-07-10

2007-07-10

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S678000

Reexamination Certificate

active

09751214

ABSTRACT:
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.

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Harper, Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, pp. 1.9-10.
Merriam Webster's Collegiate Dictionary, Meriram Webster, Tenth Edition, p. 1052.

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