IC die with directly bonded liquid cooling device

Details IC die with directly bonded liquid cooling device IC die with directly bonded liquid cooling device

2006-07-04

2006-07-04

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S714000

Reexamination Certificate

active

07071552

ABSTRACT:
An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.

REFERENCES:
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 6351387 (2002-02-01), Prasher
patent: 6365821 (2002-04-01), Prasher
patent: 6381135 (2002-04-01), Prasher et al.
patent: 6469893 (2002-10-01), Frutschy et al.
patent: 6504721 (2003-01-01), Watwe et al.
patent: 6609561 (2003-08-01), Sauciuc et al.
patent: 6650542 (2003-11-01), Chrysler et al.

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