IC module and IC card

Details IC module and IC card IC module and IC card

2006-06-20

2006-06-20

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S678000, C257S415000, C257S737000, C257S690000, C257S692000, C235S491000, C235S492000, C235S451000, C235S00700R, C361S737000, C361S728000, C174S250000, C157S001420, C427S135000

Reexamination Certificate

active

07064423

ABSTRACT:
Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.

REFERENCES:
patent: 4942495 (1990-07-01), Peres et al.
patent: 5975420 (1999-11-01), Gogami et al.
patent: 6271801 (2001-08-01), Tuttle et al.
patent: 6326683 (2001-12-01), Houdeau et al.
patent: 6568600 (2003-05-01), Carpier et al.
patent: 6642611 (2003-11-01), Iwasaki
patent: 6803666 (2004-10-01), Takahashi et al.
patent: 6896189 (2005-05-01), Guion et al.
patent: 5-262081 (1993-10-01), None

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