IC chip package

Details IC chip package IC chip package

2002-01-03

2004-09-28

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S704000, C257S709000, C257S713000, C257S783000, C257S678000

Reexamination Certificate

active

06798053

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an integrated circuit (IC) chip package and, more specifically, to a chip size package (CSP) for the IC chip.
BACKGROUND OF THE INVENTION
FIG. 1
illustrates an IC chip package according to the prior art. The package
10
comprises generally a substrate
11
, a chip
12
, and a cover
13
. The substrate
11
has a top-open receiving chamber
14
and a certain number of conductive pads
16
arranged in predetermined pattern at the bottom of the receiving chamber
14
. The chip
12
is adhered to the central portion of the bottom of the receiving chamber
14
, and electrically connected to the conductive pads
16
by bonding wires
17
. The cover
13
closes the open side of the substrate
11
to protect the chip
12
against external impact or pollutant. The cover
13
shall be made of transparent material in case the chip
12
is an image sensor such as charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS).
FIG. 2
shows another design of IC chip package
20
according to the prior art. This design is similar to the IC chip package
10
shown in FIG.
1
.
In the aforesaid package
10
, the bottom of the receiving chamber
14
must receive the chip
12
and the conductive pads
16
of the substrate
11
, and sufficient space should be provided between the chip
12
and the wall of the receiving chamber
14
for the movement of the wire bonding tool, and therefore, the area of the bottom of the receiving chamber
14
must be greater than the chip. Due to the aforesaid reasons, this package does not meet the requirements for light, thin, small, and short electronic products.
Further, since the substrate
11
is generally made of reinforced plastic or ceramic printed circuit board, it is complicated to process the receiving chamber in the substrate.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide an IC chip package, which achieves the requirement for small dimensions.
It is another objective of the present invention to provide a simple structure of IC chip package, which is easy and inexpensive to manufacture.
The IC chip package of the present invention comprises a substrate, a chip, bonding wires, adhesive means, a cover and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads arranged on the top side thereof. The chip is fixedly mounted on the top side of the substrate, which comprises a plurality of conductive pads. The bonding wires are respectively electrically connected between the conductive pads of the substrate and the conductive pads of the chip. The adhesive means is provided on the top side of the substrate around the border thereof. The cover is adapted for covering the substrate. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance


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