IC chip package having force-adjustable member between...

Details IC chip package having force-adjustable member between... IC chip package having force-adjustable member between...

2006-09-06

2008-10-28

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

C257S718000, C438S117000

Reexamination Certificate

active

07443026

ABSTRACT:
An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

REFERENCES:
patent: 5528462 (1996-06-01), Pendse
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6475011 (2002-11-01), Sinha et al.
patent: 6541855 (2003-04-01), Uzuka
patent: 6658729 (2003-12-01), Brodsky
patent: 6765397 (2004-07-01), Corbin et al.
patent: 6964885 (2005-11-01), Coico et al.
patent: 6986668 (2006-01-01), Brodsky

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