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Integrated circuit package having bypass capacitors coupled...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit package having die with staggered bond...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package having offset die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Integrated circuit package having partially exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package having posts for connection to...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit package having security feature and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Integrated circuit package having signal traces interposed betwe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package having stepped terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package including a heat pipe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Integrated circuit package including a heat sink and an adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package including a three-dimensional...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package including pin and barrel...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package including window frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package lid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package lid with a wetting film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package provided with multiple heat-conductin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Integrated circuit package receptacle

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package stacking structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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