Integrated circuit package including a heat pipe

Details Integrated circuit package including a heat pipe Integrated circuit package including a heat pipe

1992-03-20

1994-09-20

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257796, 174 152, H01L 2328

Patent

active

053492374

ABSTRACT:
A plastic-encapsulated integrated circuit includes a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, which means include a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, and a volatile fluid disposed in the container. In operation, the volatile fluid absorbs heat from the integrated circuit when it changes from the liquid state to the vapor state, and dissipates heat when it changes from the vapor state to the liquid state.

REFERENCES:
patent: 3564109 (1971-02-01), Ruechardt
patent: 3716764 (1973-02-01), Birchler et al.
patent: 4912548 (1990-03-01), Shanker et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5206791 (1993-04-01), Novotny

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