Integrated circuit package including a heat sink and an adhesive

Details Integrated circuit package including a heat sink and an adhesive Integrated circuit package including a heat sink and an adhesive

1995-11-09

2000-07-04

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, 257783, H01L 2310, H01L 2348

Patent

active

060842997

ABSTRACT:
The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.

REFERENCES:
patent: 4759970 (1988-07-01), Seeger, Jr. et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4975761 (1990-12-01), Chu
patent: 5012322 (1991-04-01), Guillotte et al.
patent: 5026748 (1991-06-01), Adams et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5369058 (1994-11-01), Burns et al.
patent: 5601675 (1997-02-01), Hoffmeyer et al.

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