Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-07-19
2011-07-19
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE21503, C257S692000, C257S693000, C438S110000
Reexamination Certificate
active
07982305
ABSTRACT:
An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.
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Cate Steven D.
Railkar Tarak A.
Advent IP, P.C., L.L.O.
Chu Chris
Maxim Integrated Products Inc.
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