Integrated circuit package provided with multiple heat-conductin

Details Integrated circuit package provided with multiple heat-conductin Integrated circuit package provided with multiple heat-conductin

1996-08-09

1998-01-20

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257704, 257738, 257774, 257780, 361713, 361719, H01L 2334, H01L 2312

Patent

active

057104590

ABSTRACT:
This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials. A printed circuit board (PCB) is used for supporting and receiving the adapter board thereon, the PCB includes a plurality of thermal vias penetrating therethrough and filled with thermal conductive materials, wherein the thermal vias corresponding to and in contact with a plurality of the conductive metal balls of the BGA for dissipating heat generated from the IC.

REFERENCES:
patent: 4193082 (1980-03-01), Dougherty
patent: 4396936 (1983-08-01), McIver et al.
patent: 4514752 (1985-04-01), Engel et al.
patent: 4724472 (1988-02-01), Sugimato et al.
patent: 4908696 (1990-03-01), Ishihara et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5371404 (1994-12-01), Juskey et al.

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