Integrated circuit package having bypass capacitors coupled...

Details Integrated circuit package having bypass capacitors coupled... Integrated circuit package having bypass capacitors coupled...

2005-05-17

2005-05-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S778000, C257S777000

Reexamination Certificate

active

06894385

ABSTRACT:
An integrated circuit package is disclosed. The integrated circuit package includes a package substrate having a top and a bottom. Further, the integrated circuit package includes a plurality of bypass capacitors coupled to the bottom of the package substrate without a cavity. Moreover, the integrated circuit package includes an array of solder balls formed on the bottom of the package substrate. The array of solder balls facilitates surface mounting to a printed circuit board assembly. Also, the solder balls provide sufficient space between the printed circuit board assembly and the bypass capacitors. In an embodiment, the package substrate is an organic substrate.

REFERENCES:
patent: 5939782 (1999-08-01), Malladi
patent: 6353540 (2002-03-01), Akiba et al.
patent: 6400576 (2002-06-01), Davidson
patent: 6518666 (2003-02-01), Ikeda
patent: 6535398 (2003-03-01), Moresco
patent: 6727780 (2004-04-01), Novak et al.
patent: 20020011662 (2002-01-01), Komiya et al.
patent: 20020074653 (2002-06-01), Khandros et al.
patent: 20020185308 (2002-12-01), Cornelius et al.
patent: 61-24255 (1986-02-01), None

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