Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2009-06-16
2011-12-13
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S797000, C257SE23179, C219S121690
Reexamination Certificate
active
08076776
ABSTRACT:
An integrated circuit package comprises a package substrate (210, 410), an electrically insulating material (220, 420) adjacent to the package substrate, and a mark (230, 420) on the electrically insulating material. The mark is such that a visual contrast between the mark and the electrically insulating material is maximized when the mark and the electrically insulating material are exposed to coaxial illumination. In one embodiment the electrically insulating material over the package substrate has a first surface roughness and a mark on the solder resist material has a second surface roughness that is no more than approximately twenty times greater than the first surface roughness.
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Bhate Dhruv P.
Voronov Sergei L.
Clark Jasmine
Intel Corporation
Nelson Kenneth A.
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