Integrated circuit package lid with a wetting film

Details Integrated circuit package lid with a wetting film Integrated circuit package lid with a wetting film

2007-03-16

2009-12-15

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23003, C257SE23024, C257SE23188, C257SE21502, C257SE21505, C257SE23193, C257SE23104, C257SE23090, C257SE23087, C257S023000, C257SE25013, C257S711000, C438S126000, C438S118000, C438S125000

Reexamination Certificate

active

07633151

ABSTRACT:
Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced.

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