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High density memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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High density memory structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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High density multi-layered printed wiring board, multi-chip carr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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High density multichip package with interconnect structure and h

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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High density multilayer circuit module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density package with wrap around interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density packaging of solid state devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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High density semiconductor device having inclined chip mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density signal interposer with power and ground wrap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density stacked die assemblies, structures incorporated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density three dimensional semiconductor die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density vertically mounted semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density wire bond pattern for integratd circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High density, high speed, semiconductor interconnect using-multi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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High frequency circuit apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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High frequency circuit module and communication device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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High frequency device module and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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High frequency IC package, high frequency unit using high...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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High frequency IC package, high frequency unit using high...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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High frequency microelectronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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