High density package with wrap around interconnect

Details High density package with wrap around interconnect High density package with wrap around interconnect

2006-09-26

2006-09-26

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23191

Reexamination Certificate

active

07112877

ABSTRACT:
A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece.

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patent: 2004/0047135 (2004-03-01), Bando

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