Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1996-02-23
1998-11-24
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257668, 257700, 257693, 257702, 257680, H01L 2328, H01L 2312
Patent
active
058411909
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates generally to a high density multi-layered printed wiring board (ML-PWB), multi-chip carrier and semiconductor package.
BACKGROUND ART
Progress in the field of industrial electronics, typified by large-scale computer systems, has been accelerated in recent years. The main part of each device used in such computer system includes a large printed wiring board, called a "mother board", on which semiconductor packages and other electronic parts are mounted. A semiconductor package contains one or more bare semiconductor chips, and assists a semiconductor chip provided thereon to properly function. In order to develop high performance electronics, therefore, it is very important not only to improve the performance of semiconductor chips but also to improve the performance of whole packages of semiconductor devices.
A semiconductor package has several functions or roles. The first function is to establish electrical connections between semiconductor chips in a system. The semiconductor chips in a package should be supplied with power from an external power supply in order to operate. The power is provided to the semiconductor chips from a mother board via the package. Signal communications between the mother board and the semiconductor chips are also done via the package. The second function of a semiconductor package is to protect bare chips mounted thereon. Protecting semiconductor chips from external environments such as contaminants, light and shocks or impacts is required to maintain stable operations of electronic circuits for a long time. The third function of a semiconductor package is to dissipate heat from semiconductor chips thereon. This prevents the semiconductor chips from failing to normally function and from breaking down due to the overheating of the chips by the heat generated by power consumption of the circuits on the chips. The fourth function of a semiconductor package is to mount semiconductor chips on the package. Since semiconductor chips are too small in size to be handled, it is difficult to mount them directly on a mother board. It is therefore required to use a package enclosing semiconductor chips to facilitate the handling of the chips.
Plastic packages made of resin materials are currently used as packages for semiconductor chips. Plastic packages have the advantage of being made from inexpensive material, but have the disadvantage of a low heat dissipating efficiency. This advantage and disadvantage are derived from the fact that synthetic resin is used as the prime constituent of the package. In designing a plastic package it is therefore required that a heat dissipating structure be provided in order to avoid malfunctions and breakdowns of the chips mounted on the package. One remedy prescribed for the heat problem of plastic package is to provide heat slugs in a substrate of the package, to be diebonded with bare chip. Metal plates with high heat conductivity (e.g. Cu-W alloy plates) are often appropriate heat slugs.
FIG. 30 illustrates an example of conventional plastic packages provided with heat slugs. The package 151 shown in FIG. 30 is a pin grid array (PGA) which is a pin-insertion type semiconductor package. In the package 151, a plurality of semiconductor chips 153 are mounted on a substrate 152. Therefore, this type of package is often called multi chip module (MCM). The substrate 152 constituting the package 151 is made of synthetic resin, and has a plurality of through holes 154, each of which has a size substantially equal to the size of each chip. Heat slugs 155 are fitted into the holes 154. On the surface of the substrate 152, the chips 153 are diebonded with the heat slugs 155. The substrate 152 incorporates a plurality of I/O pins 156 as external connecting terminals provided in its peripheral portion. Each of the chips 153 is electrically connected to I/O pins 156 via bonding wires 157 and interconnection wirings 158. According to this structure, heat paths are provided from the chips 153 towards the heat slugs
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Inoue Tooru
Noda Kouta
Yuan Benzhen
Ibiden Co. Ltd.
Thomas Tom
Williams Alexander Oscar
LandOfFree
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