High density, high speed, semiconductor interconnect using-multi

Details High density, high speed, semiconductor interconnect using-multi High density, high speed, semiconductor interconnect using-multi

1993-10-28

1996-04-16

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257701, 257778, H01L 2348

Patent

active

055085580

ABSTRACT:
An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points.

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patent: 4993958 (1991-02-01), Trobough et al.
patent: 5018005 (1991-05-01), Lin et al.
patent: 5057907 (1991-10-01), Ooi et al.
patent: 5065227 (1991-11-01), Frankeny
patent: 5065279 (1991-11-01), Lazenby
patent: 5069628 (1991-12-01), Crumly
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5099393 (1992-03-01), Bentlage et al.
patent: 5160999 (1992-11-01), Opitz

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