High density vertically mounted semiconductor package

Details High density vertically mounted semiconductor package High density vertically mounted semiconductor package

1993-08-25

1994-09-20

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257730, 257723, 361772, 365 52, H01L 2316

Patent

active

053492358

ABSTRACT:
A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package. Also, since the leads are alternately formed and the packages can be mounted near to each other, the package occupies only a small area of the PCB, thereby improving the packing density.

REFERENCES:
patent: 4266282 (1981-05-01), Henle et al.
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5260601 (1993-11-01), Baudouin et al.

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