High frequency IC package, high frequency unit using high...

Details High frequency IC package, high frequency unit using high... High frequency IC package, high frequency unit using high...

2008-03-04

2008-03-04

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

Reexamination Certificate

active

07339269

ABSTRACT:
A high frequency IC package and high frequency unit are simplified and downsized, and the number of manufacturing processes is reduced. The part9to determine a characteristic of the high frequency IC chip is arranged outside the sealing14of the high frequency IC package5. The part can be arranged on the package board7, circuit board4or housing chassis1. When the part is arranged outside the sealing, the package and the high frequency unit6on which the package is mounted can be downsized. In the case of arranging the part on the circuit board, the part can be mounted together with other surface mounting parts. Therefore, the number of manufacturing processes can be reduced.

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