High density wire bond pattern for integratd circuit package

Details High density wire bond pattern for integratd circuit package High density wire bond pattern for integratd circuit package

1994-09-14

1996-06-25

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257700, 257697, H01L 2348, H01L 2352

Patent

active

055302874

ABSTRACT:
An improved integrated circuit package having high density interconnections between die pads and a plurality of coplanar connector tabs on a selected metal layer in the integrated circuit package, wherein the pitch of the connector tabs is a predetermined multiple of the pitch of the die pads.

REFERENCES:
patent: 5117275 (1992-05-01), Bregman et al.
patent: 5235211 (1993-08-01), Hamburgen

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