Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-06-22
1995-04-25
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257776, 257775, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054101824
ABSTRACT:
A semiconductor device having a rectangular COB substrate body, a die pad on the surface of the substrate body, a plurality of outer leads at the periphery of the substrate body, a plurality of wiring patterns on the surface of the substrate body connected to corresponding outer leads, a plurality of inner leads on the surface of the substrate body surrounding the die pad, connected to corresponding outer leads by the corresponding wiring patterns, and arranged in a substantially rectangular shape having sides, each respectively forming a predetermined acute angle with respect to a corresponding side of the substrate body whereby intervals between adjacent wiring patterns are longer than a predetermined length, a semiconductor chip having a plurality of electrode pads and mounted on the die pad, and a plurality of wires establishing electrical connections between the plurality of electrode pads of the semiconductor chip and corresponding inner leads.
REFERENCES:
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5237205 (1993-08-01), Newman
Deutsch et al, "45.degree. Wiring Layers for a Thin Film Module Package", IBM Technical Disclosure Bulletin, vol. 24, No. 1B Jun. 1981, pp. 730-731.
Ishimaru Yoshiyuki
Kimura Kenji
Kurafuchi Kazuhiko
Ochi Katsunori
Clark S. V.
James Andrew J.
Mitsubishi Denki & Kabushiki Kaisha
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