High density packaging of solid state devices

Details High density packaging of solid state devices High density packaging of solid state devices

1992-01-06

1993-05-18

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257734, 257778, 257532, H01L 2348, H01L 2302, H01L 2316, H01L 2702

Patent

active

052124061

ABSTRACT:
An assembly of multiple quantities of solid state memory modules, built upon a high density interconnect substrate, is described. Each memory module is of itself constructed from a multiple number of separate bare solid state memory die appropriate to the function. A multiplicity of the memory modules are constructed on a single substrate, and thereupon each module is separated from the single substrate. The separate memory die are mounted to the surface of the high density substrate, which provides the interconnection necessary to complete the memory function. The high density substrate also provides the capability for close attached capacitors for signal filtering, test vias for optimal module test and thermal vias as appropriate. The provision for multiple memory modules enables economical manufacturing plus capability for systems level interconnect.

REFERENCES:
patent: 4419530 (1983-12-01), Nath
patent: 4426773 (1984-01-01), Hargis
patent: 4578697 (1986-03-01), Takemae
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4742385 (1988-05-01), Kohmoto
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4806503 (1989-02-01), Yoshida et al.
patent: 4812742 (1989-03-01), Abel et al.
patent: 4816422 (1989-03-01), Yerman et al.

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