Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1993-11-03
1996-06-04
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257676, 257725, 257777, 257469, H01L 2302, H01L 2334
Patent
active
055236197
ABSTRACT:
A memory cube comprising a plurality of memory chips, each having a plurality of data storage devices, is provided with an auxiliary chip having inactive line termination circuits and the auxiliary chip or chips are formed as part of the memory cube structure and disposed among the memory chips on an interleave basis. The auxiliary circuit chips are provided with external terminals connected to memory input leads, control leads and data write leads, in close proximity to the termination point of the leads. A decoupling capacitor, integrated in the auxiliary circuit chip, is connected to the power bus in the memory cube structure and eliminates extraneous noise problems occurring with discrete capacitors external to the cube. A heating resistor is provided on the auxiliary circuit chip to maintain the cube structure at a near constant temperature. Temperature sensing diodes are incorporated in the auxiliary chip to provide an accurate mechanism for sensing the temperature internal to the cube.
REFERENCES:
patent: 3832575 (1974-08-01), Dasgupta et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4365284 (1982-12-01), Tanaka
patent: 4525921 (1985-07-01), Carson et al.
patent: 4553050 (1985-11-01), Feinberg et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4706166 (1987-11-01), Go
patent: 4714981 (1987-12-01), Gordon
patent: 4841170 (1989-06-01), Eccleston
patent: 4879631 (1989-11-01), Johnson et al.
patent: 5104820 (1992-04-01), Go et al.
patent: 5138437 (1992-08-01), Kumamoto et al.
Garth, "Memory System--An Ultimate in Packaging Technology", Electro 78 Conference, May 1978, pp. 1-2.
Bhatia et al., "Multilayer Glass Ceramic Substrate Design For SS-1 Supercomputer", 43rd Electronic Components and Technology Conference, Jun. 1993, pp. 935-940.
McAllister Michael F.
McDonald James A.
Robbins Gordon J.
Swaminathan Madhavan
Wilkins Gregory M.
Augspurger Lynn L.
Crane Sara W.
International Business Machines - Corporation
Tang Alice W.
Visserman Peter
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