LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device for electronic packaging, pin jig fixture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device for establishing non-permanent electrical connection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device for establishing non-permanent electrical connection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Device for mounting a semiconductor package on a support...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device for packaging electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Device for removing a flip chip die from packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device for sealing and cooling multi-chip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device for securing a finned radiating structure to a computer c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device for thermal transfer and power generation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Device having a bonding structure for two elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Device having a complaint element pressed between substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Device having a heat sink for cooling an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device having pins formed of hardened mixture of conductive meta

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Device having resin package and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Device having resin package with projections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Device made of single-crystal silicon

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Device mounting board and semiconductor apparatus using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Device package and methods for the fabrication and testing...