Device having pins formed of hardened mixture of conductive meta

Details Device having pins formed of hardened mixture of conductive meta Device having pins formed of hardened mixture of conductive meta

1994-11-29

1996-11-12

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257741, 257773, H01L 23498

Patent

active

055743110

ABSTRACT:
An electrode-pin forming mask is used to form electrode pins on the semiconductor chip. The electrode-pin forming mask has electrode-pin forming holes matching electrode pads previously formed on the semiconductor chip. A screen-printing technique is used to form the electrode pins on the semiconductor chip through the electrode-pin forming mask. That is, conductive material in a paste state is pushed into the electrode-pin forming holes in a condition where the electrode-pin forming mask has been placed on the semiconductor chip and positions of the electrode-pin forming holes match positions of the electrode pads of the semiconductor chip, respectively. The conductor material thus pushed into the electrode-pin forming holes is thus shaped as to form the electrode pins projecting from the electrode pads of the semiconductor chip. Then, the electrode-pin forming mask is removed from the semiconductor chip while the thus shaped conductor material continues to be projected from the electrode pads of the semiconductor chip. Thus, the electrode pins are formed on the semiconductor chip.

REFERENCES:
patent: 4724472 (1988-02-01), Sugimoto et al.

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