Device having resin package and method of producing the same

Details Device having resin package and method of producing the same Device having resin package and method of producing the same

2005-02-15

2005-02-15

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S734000, C257S736000, C257S737000

Reexamination Certificate

active

06856017

ABSTRACT:
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

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