Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-07-10
2007-07-10
Potter, Roy Karl (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S704000
Reexamination Certificate
active
11049407
ABSTRACT:
Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts the walls improves the cohesiveness of the package. By appropriately positioning these features contaminant infusion into the package is improved without degrading cohesiveness.
REFERENCES:
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5710695 (1998-01-01), Manteghi
Brennan John M.
Freund Joseph Micheal
Moyer Ralph S.
Osenbach John William
Safar Hugo Fernando
Agere Systems Inc.
Potter Roy Karl
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