Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1997-06-06
2000-05-16
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257700, 257758, 257782, 361761, 361780, 361790, 361794, H01L 2334, H01L 23053, H01L 2348, H01L 2352
Patent
active
060641169
ABSTRACT:
An inventive printed circuit board for chip-on-board applications has a ground plane that is externally exposed through apertures in any overlying layers in the board so the backside surface of a bare integrated circuit die can be directly attached to the ground plane using a silver-filled epoxy. As a result, heat is conducted away from the die through the ground plane. Also, a substrate bias voltage can be supplied to the backside surface of the die through the ground plane to eliminate the need for an internal substrate bias to the die, and to eliminate the need for a substrate bias voltage bond pad on the front-side surface of the die.
REFERENCES:
patent: 4038488 (1977-07-01), Lin
patent: 4283755 (1981-08-01), Tracy
patent: 4578697 (1986-03-01), Takemae
patent: 4729061 (1988-03-01), Brown
patent: 4903114 (1990-02-01), Aoki et al.
patent: 5138436 (1992-08-01), Koepf
patent: 5311396 (1994-05-01), Steffen
patent: 5497027 (1996-03-01), Crafts
patent: 5768109 (1998-06-01), Gulick et al.
Arroyo Teresa M.
Micro)n Technology, Inc.
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