Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
2006-03-14
2006-03-14
Tran, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257S680000, C257S726000, C257S731000, C257S732000
Reexamination Certificate
active
07012331
ABSTRACT:
A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.
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Brechignac Rémi
Channon Kevin
Exposito Juan
Jenkens & Gilchrist PC
Mondt Johannes
STMicroelectronics S.A.
Tran Minhloan
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