Device for mounting a semiconductor package on a support...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Reexamination Certificate

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Details

C257S680000, C257S726000, C257S731000, C257S732000

Reexamination Certificate

active

07012331

ABSTRACT:
A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

REFERENCES:
patent: 5424531 (1995-06-01), O'Regan et al.
patent: 5816828 (1998-10-01), Ikeya et al.
patent: 5920770 (1999-07-01), Yasunaga et al.
patent: 6000125 (1999-12-01), Kang
patent: 6020635 (2000-02-01), Murphy
patent: 6518659 (2003-02-01), Glenn
patent: 6565374 (2003-05-01), Corisis et al.
patent: 04-111686 (1992-04-01), None
patent: 111686 (1992-04-01), None
patent: 08-096911 (1996-04-01), None
patent: 096911 (1996-04-01), None
patent: 10-284205 (1998-10-01), None
patent: 284205 (1998-10-01), None
patent: 2000-284205 (2000-02-01), None
patent: 040572 (2000-02-01), None
patent: 2001-188155 (2001-07-01), None
patent: 188155 (2001-07-01), None
patent: 02001188155 (2001-07-01), None
French Search Report, FA 616384/FR 0201427, dated Dec. 4, 2002.
Patent Abstracts of Japan, vol. 2000, No. 24, May 11, 2000; JP 2001 188155 A (Kuurii Components KK; Shinten Sangyo Co Ltd), Jul. 10, 2001.
Patent Abstracts of Japan, vol. 1999, No. 01, Jan. 29, 1999; JP 10 284205A (NEC. Corp), Oct. 23, 1998.
Patent Abstracts of Japan, vol. 2000, No. 05, Sep. 14, 2000; JP 2000 040572 A (NEC Eng Ltd), Feb. 8, 2000.
Patent Abstracts of Japan, vol. 1996, No. 08, Aug. 30, 1996; JP 08 096911 A (Shinano Polymer KK; Shin ETSU Polymer Co Ltd), Apr. 12, 1996.
Patent Abstracts of Japan, vol. 016, No. 354, (E-1242), Jul. 30, 1992; JP 04 111686 A (Cannon Inc), Apr. 13, 1992.
French Preliminary Search Report, FA 616384/FR 0201427, dated Dec. 4, 2002.

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