Device having resin package with projections

Details Device having resin package with projections Device having resin package with projections

1996-11-06

2000-06-06

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257787, 257738, H01L 2304, H01L 2331

Patent

active

060722398

ABSTRACT:
A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.

REFERENCES:
patent: 4724280 (1988-02-01), Tsuji et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5502631 (1996-03-01), Adachi
patent: 5521427 (1996-05-01), Chia et al.
patent: 5523628 (1996-06-01), Williams et al.
patent: 5567984 (1996-10-01), Zalesinski et al.
patent: 5625230 (1997-04-01), Park et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5633535 (1997-05-01), Chao et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5670826 (1997-09-01), Bessho et al.

Affiliated with

Also associated with

Rating

Device having resin package with projections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device having resin package with projections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device having resin package with projections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2215773