LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Chip carrier plate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Chip carrier structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier structure having semiconductor chip embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier substrate with a land grid array and external...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier with embedded leads and chip package using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Chip carrier with peripheral stiffener and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip carrier, semiconductor package and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Chip component and method for producing a chip component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Chip cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip cooling channels formed in wafer bonding gap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Chip cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Chip cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Chip edge interconnect apparatus and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Chip electronic part

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip embedded package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Chip for multi-chip semiconductor device and method of manufactu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Chip heat dissipation structure and manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Chip holder with wafer level redistribution layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Chip module and chip card