Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2006-08-11
2009-10-20
Clark, Sheila V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S678000
Reexamination Certificate
active
07605453
ABSTRACT:
A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.
REFERENCES:
patent: 4639585 (1987-01-01), Haghiri-Tehrani et al.
patent: 4980802 (1990-12-01), Champagne et al.
patent: 5097117 (1992-03-01), Champagne et al.
patent: 7086601 (2006-08-01), Dhers et al.
patent: 2009/0040695 (2009-02-01), Fidalgo et al.
patent: 693 27 308 (2000-08-01), None
patent: 697 01 142 (2000-09-01), None
patent: 698 19 299 (2004-07-01), None
patent: 0 207 852 (1987-01-01), None
patent: 0 297 991 (1989-01-01), None
patent: 0 343 030 (1989-11-01), None
patent: 0952542 (1999-10-01), None
patent: 1492048 (2004-12-01), None
patent: 0 862 134 (2005-01-01), None
patent: 2684471 (1993-06-01), None
patent: 2749687 (1997-12-01), None
patent: 2786009 (2000-05-01), None
patent: 08-153946 (1996-06-01), None
Binder Birgit
Heinemann Erik
Puschner Frank
Stampka Peter
Clark Sheila V
Dickstein , Shapiro, LLP.
Infineon - Technologies AG
LandOfFree
Chip module and chip card does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip module and chip card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip module and chip card will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4093137