Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2005-06-21
2005-06-21
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S710000
Reexamination Certificate
active
06909177
ABSTRACT:
A chip carrier plate. The chip carrier plate comprises a base, a protruding face, and a receiving face. The protruding face is disposed on the base. The receiving face is formed on another side of the base opposite to the protruding face. A plurality of recesses is formed on the protruding face. Each recess has a first spacer and a second spacer disposed on the bottom surface therein.
REFERENCES:
patent: 4654693 (1987-03-01), Funakoshi et al.
patent: 5666064 (1997-09-01), Kasai et al.
patent: 6079565 (2000-06-01), Walsh et al.
patent: 6573121 (2003-06-01), Yoneda et al.
patent: 2002/0158646 (2002-10-01), DiFrancesco
patent: 08-011930 (1996-01-01), None
AU Optronics Corp.
Clark S. V.
Thomas Kayden Horstemeyer & Risley
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