Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-11-13
2007-11-13
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C361S689000, C361S699000
Reexamination Certificate
active
11232499
ABSTRACT:
A chip cooling system including a semiconductor device having a bulk region, wherein at least one fluid channel extends at least partially through the bulk region, the fluid channel having an inlet and an outlet, a fluid inlet port in fluid communication with the channel inlet, and a fluid outlet port in fluid communication with the channel outlet, and a cooling fluid flows from the fluid inlet port, through the fluid channel and to the fluid outlet port to cool the bulk region.
REFERENCES:
patent: 2004/0132166 (2004-07-01), Miller et al.
patent: 2005/0032204 (2005-02-01), Rodgers et al.
patent: 2005/0168947 (2005-08-01), Mok et al.
patent: 2006/0042825 (2006-03-01), Lu et al.
Myers Bruce A.
Schubert Peter J.
Chambliss Alonzo
Delphi Technologies Inc.
Funke Jimmy L.
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