Chip heat dissipation structure and manufacturing method

Details Chip heat dissipation structure and manufacturing method Chip heat dissipation structure and manufacturing method

2006-02-17

2008-09-23

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S678000, C257S704000, C257SE21170, C257SE21005, C257SE21270, C257SE23109, C257SE23111

Reexamination Certificate

active

07427807

ABSTRACT:
This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

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