Chip carrier with peripheral stiffener and semiconductor device

Details Chip carrier with peripheral stiffener and semiconductor device Chip carrier with peripheral stiffener and semiconductor device

1997-03-14

1998-11-24

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Portion of housing of specific materials

257702, 257668, H01L 2306

Patent

active

058411941

ABSTRACT:
A carrier substrate comprises a flexible insulating substrate containing aramid fiber as a reinforcer, first bonding pads formed on one side of the flexible insulating substrate, and second bonding pads formed on the other side of the flexible insulating substrate, where the first bonding pads and the second bonding pads are electrically bonded by via-holes punched in the flexible insulating substrate. The carrier substrate and a peripheral stiffener made of a material whose thermal expansion coefficient is higher than that of the carrier substrate compose a chip carrier, and an LSI chip is mounted on the recess of the chip carrier.

REFERENCES:
patent: 4318954 (1982-03-01), Jensen
patent: 5067004 (1991-11-01), Marshall et al.
patent: 5067008 (1991-11-01), Yanaka et al.
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5702985 (1997-12-01), Burns
Array Packaging, Opportunities and Implications for the Electronics Industry, BPA, Report No. 492, Mar. 1993.

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