Chip carrier with embedded leads and chip package using same

Details Chip carrier with embedded leads and chip package using same Chip carrier with embedded leads and chip package using same

1996-07-29

1999-12-14

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257686, 257690, H01L 2304

Patent

active

060021705

ABSTRACT:
A chip package includes a flat plate body or carrier with a plurality of leads embedded therein but exposed at the first and second surfaces, e.g., the top and bottom surfaces, of the plate body. The body has a predetermined shape and may include a recess formed in the upper surface of the body to a prescribed depth. A semiconductor chip is mounted on the upper surface of the plate body or carrier. Metallic bonding wires electrically connect the leads of the body with the bonding pads of the chip, and an epoxy molding compound seals a predetermined portion including the chip, the leads, and the metallic wires. A plurality of like chip packages may be vertically stacked. Instead of epoxy molding, a thin lid having leads similarly embedded therein may be attached to the upper surface of the body.

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patent: 5574309 (1996-11-01), Papapietro et al.
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patent: 5608265 (1997-03-01), Kitano et al.

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