Chip carrier structure having semiconductor chip embedded...

Details Chip carrier structure having semiconductor chip embedded... Chip carrier structure having semiconductor chip embedded...

2011-02-01

2011-02-01

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S684000, C257S686000, C257S707000, C257S690000, C438S106000, C438S109000, C438S121000, C438S124000

Reexamination Certificate

active

07880296

ABSTRACT:
The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal layer formed by electroplating on the bottom surface and side surfaces of the chip-embedded carrier structure. The metal layer prevents moisture from crossing the side surfaces of the chip-embedded carrier structure, so as to prevent delamination, provide a shielding effect, and improve heat dissipation through the metal layer.

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patent: 2008/0128865 (2008-06-01), Chia

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