Chip holder with wafer level redistribution layer

Details Chip holder with wafer level redistribution layer Chip holder with wafer level redistribution layer

2007-02-16

2011-11-01

Williams, A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S780000, C257SE23009, C257SE23020, C257SE23021, C257SE21511, C257S686000, C257S685000, C257S777000, C257S723000, C257S728000, C257S773000, C257S774000

Reexamination Certificate

active

08049323

ABSTRACT:
A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are formed on or over an area of the chip holder that surrounds the semiconductor chip thus expanding the bonding area. The bond pads are coupled, using semiconductor wafer processing techniques, to internal bond pads formed directly on the semiconductor chip.

REFERENCES:
patent: 4451845 (1984-05-01), Philofsky et al.
patent: 4639760 (1987-01-01), Granberg et al.
patent: 4677741 (1987-07-01), Takahama
patent: 5188984 (1993-02-01), Nishiguchi
patent: 5652466 (1997-07-01), Hirakawa et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 6115255 (2000-09-01), Iovdalsky
patent: 6271469 (2001-08-01), Ma et al.
patent: 7446402 (2008-11-01), Hsu
patent: 7655501 (2010-02-01), Yang et al.
patent: 2003/0133274 (2003-07-01), Chen et al.
patent: 2003/0156402 (2003-08-01), Ding et al.
patent: 2005/0088190 (2005-04-01), Cheng et al.
patent: 2006/0076686 (2006-04-01), Tuominen et al.
patent: 2007/0158861 (2007-07-01), Huang et al.
patent: 2008/0132006 (2008-06-01), Jiang et al.
patent: 2008/0157316 (2008-07-01), Yang
patent: 2008/0157396 (2008-07-01), Yang
patent: 2008/0173792 (2008-07-01), Yang et al.
patent: 2008/0182366 (2008-07-01), Ogawa et al.
patent: 2008/0191297 (2008-08-01), Yang et al.
patent: 2008/0197435 (2008-08-01), Yang et al.
patent: 2008/0197469 (2008-08-01), Yang et al.
patent: 2008/0217761 (2008-09-01), Yang et al.
patent: 2008/0224306 (2008-09-01), Yang
patent: 2008/0248614 (2008-10-01), Yang et al.
patent: 2008/0274579 (2008-11-01), Yang et al.
patent: 2009/0057903 (2009-03-01), Okayama et al.
patent: 2009/0079062 (2009-03-01), Koide
patent: 2009/0085436 (2009-04-01), Kartashev et al.
patent: 2009/0206464 (2009-08-01), Chung et al.
patent: 2010/0112735 (2010-05-01), Lee et al.
patent: 2005-209689 (2005-08-01), None

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