Chip embedded package structure

Details Chip embedded package structure Chip embedded package structure

2007-01-30

2007-01-30

Tran, Minh Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S797000, C257SE23179, C257SE23176, C257SE23064

Reexamination Certificate

active

10994043

ABSTRACT:
A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening such that the bonding pads face the tape. A plurality of through holes is formed in the tape to expose the bonding pads respectively. After that, an electrically conductive material is deposited to fill the through holes and form a plurality of conductive vias that connects with the bonding pads respectively. A multi-layered interconnection structure is formed on the surface of the tape away from the chip. The multi-layered interconnection structure has an inner circuit that connects to the conductive vias. The inner circuit has a plurality of metallic pads disposed on the outer surface of the multi-layered interconnection structure.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 6154366 (2000-11-01), Ma et al.
patent: 6166433 (2000-12-01), Takashima et al.
patent: 6475877 (2002-11-01), Saia et al.
patent: 6864165 (2005-03-01), Pogge et al.
patent: 7026079 (2006-04-01), Louwet et al.
patent: 2002/0011650 (2002-01-01), Nishizawa et al.
patent: 2003/0043565 (2003-03-01), Juang
patent: 2003/0155908 (2003-08-01), Ohazama

Affiliated with

Also associated with

Rating

Chip embedded package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip embedded package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip embedded package structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3815244