Chip component and method for producing a chip component

Details Chip component and method for producing a chip component Chip component and method for producing a chip component

2007-11-06

2007-11-06

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S665000, C257S680000, C257S684000, C257S718000, C257S781000, C257S434000, C257SE23149

Reexamination Certificate

active

11304491

ABSTRACT:
A chip component (1) includes a semiconductor body (2), in which at least one switchable element (6, 62) is arranged in a partial region (24) of the semiconductor body (2). The partial region (24) can be reached by light of at least one wavelength. Furthermore, a circuit (9) integrated into the semiconductor body (2) is provided, which integrated circuit can assume one configuration from at least two possible configurations, one of these configurations being prescribed by a state of the at least one switchable element (6, 62). Furthermore, a housing (3) is provided, which encloses the semiconductor body (2) and is arranged with a partial region (35, 32) at least partly above the partial region (24) of the semiconductor body (2). The partial region (35, 32) of the housing (3) is formed in such a way that light can be fed to the partial region (24) of the semiconductor body (2). It is thus possible even after a fabrication process to carry out a test and, if appropriate, to define a different configuration through switching of the element (6, 62).

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patent: WO 97/124401 (1997-04-01), None

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