Chip for multi-chip semiconductor device and method of manufactu

Details Chip for multi-chip semiconductor device and method of manufactu Chip for multi-chip semiconductor device and method of manufactu

1998-04-23

2000-07-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257698, 257777, 257774, 257723, 257434, 250548, 25055929, 2505593, 2504811, 356 6, 356399, H01L 2302

Patent

active

060877197

ABSTRACT:
A plurality of chips each having two or more alignment holes for transmitting a laser beam are stacked. The laser beam is irradiated onto the uppermost or lowermost one of the stacked chips. A photodetector detects the laser beam output from the stacked chips through the alignment holes in these chips. The positions of the chips are so controlled that the amount of the light detected by this photodetector is a maximum.

REFERENCES:
patent: 4499655 (1985-02-01), Anthony
patent: 4807021 (1989-02-01), Okumura
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5637907 (1997-06-01), Leedy
patent: 5821549 (1998-10-01), Talbot et al.

Affiliated with

Also associated with

Rating

Chip for multi-chip semiconductor device and method of manufactu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip for multi-chip semiconductor device and method of manufactu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip for multi-chip semiconductor device and method of manufactu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-544754