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Chip scale packaging with multi-layer flip chip arrangement...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Chip scale stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip scale surface mounted device and process of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip size stack package, memory module having the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Chip stack employing a flex circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Chip stack package utilizing a connecting hole to improve...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack package utilizing a dummy pattern die between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack package, connecting board, and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack with differing chip package types

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack, chip stack package, and method of forming chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stack-type semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip stacking by edge metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Chip stacking structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip structure and stacked-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip supporting substrate for semiconductor package,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip type electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Chip type electronic part

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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