Chip stack and method of making same

Details Chip stack and method of making same Chip stack and method of making same

1995-04-13

1997-03-18

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 257723, 257777, H01L 2302

Patent

active

056125704

ABSTRACT:
An integrated circuit chip stack includes a stack of chip packages mounted on a substrate. Each chip package includes a plastic packaged chip mounted within a central aperture in a thin, planar frame by soldering leads at opposite ends of the plastic package to conductive pads on an upper surface of the frame adjacent the central aperture. Conductive traces and vias couple the conductive pads to other conductive pads on upper and lower surfaces of the frame adjacent outer edges thereof. The conductive pads adjacent the outer edges are soldered to the conductive pads of adjacent chip packages by dipping the edges of an assembled stack of the chip packages in solder. The chip stack thus formed is mounted on a substrate. Each chip package can be individually addressed by the substrate, such as to enable the chip therein, using a stair step arrangement of the conductive pads in which the pads on the opposite surfaces of each frame are coupled in offset fashion by vias extending through the frame.

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patent: 5239447 (1993-08-01), Cotues et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5313096 (1994-05-01), Eide
patent: 5373189 (1994-12-01), Massit et al.
patent: 5384689 (1995-01-01), Shen
Research Disclosure, Organic Card Device Carrier, 31318, May 1990, No. 313.

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