Chip type electronic component

Details Chip type electronic component Chip type electronic component

1997-10-14

1998-05-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257687, 257735, 257773, 257775, 257924, 338203, 338272, 338306, 338307, 338308, 338309, 361303, 3613061, 361310, H01L 2334, H01L 2348, H01C 1012, H01G 4005

Patent

active

057570760

ABSTRACT:
A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.

REFERENCES:
patent: 4417298 (1983-11-01), Nakata et al.
patent: 4539623 (1985-09-01), Irikura et al.
patent: 4899126 (1990-02-01), Yamada
patent: 5065211 (1991-11-01), Imamura
patent: 5311651 (1994-05-01), Kim et al.
patent: 5345361 (1994-09-01), Billotte et al.
patent: 5406027 (1995-04-01), Matsumoto et al.

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