Chip stack, chip stack package, and method of forming chip...

Details Chip stack, chip stack package, and method of forming chip... Chip stack, chip stack package, and method of forming chip...

2011-06-21

2011-06-21

Pizarro, Marcos D (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S777000, C257SE25006, C257SE25013, C257S025000, C257SE25021, C257SE25027, C438S109000

Reexamination Certificate

active

07964948

ABSTRACT:
A chip stack may include a first chip and a second chip stacked on the first chip. Each of the first and second chips may include a substrate having an active surface and an inactive surface opposite to the active surface; an internal circuit in the active surface; an I/O chip pad on the active surface and connected to the internal circuit through an I/O buffer; and a I/O connection pad connected to the I/O chip pad through the I/O buffer by a circuit wiring. A redistributed I/O chip pad layer may be on the active surface of the first chip, the redistributed I/O chip pad layer redistributing the I/O chip pad. The I/O connection pads of the first chip and the second chip may be electrically connected to each other by an electrical connecting part.

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