Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1999-05-10
2000-10-24
Wilczewski, Mary
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257686, 257786, 257723, 257724, 438107, 438111, 438612, H01L 2348
Patent
active
061371629
ABSTRACT:
Disclosed is a chip stack package having a remarkably short interconnection paths between the semiconductor chips and external device, and between the respective semiconductor chips. The chip stack package comprises: at least two semiconductor chips disposed in series vertically in the package, wherein bonding pads are disposed at both sides of the respective semiconductor chips and vertically open slots are formed in the bonding pads; lead frames inserted into the slots of the respective semiconductor chips so as to electrically connect the respective bonding pads; and an epoxy compound for molding the resultant structure entirely so as to expose an interconnection portion of the respective lead frames.
REFERENCES:
patent: 4764846 (1988-08-01), Go
patent: 5327327 (1994-07-01), Frew et al.
patent: 5343366 (1994-08-01), Cipolla et al.
patent: 5376756 (1994-12-01), Kwon
patent: 5514905 (1996-05-01), Sakuta et al.
patent: 5514907 (1996-05-01), Moshayedi
patent: 5600541 (1997-02-01), Bone et al.
patent: 5612570 (1997-03-01), Eide et al.
patent: 5686762 (1997-11-01), Langley
patent: 5728601 (1998-03-01), Sato et al.
patent: 5781413 (1998-07-01), Howell et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5821625 (1998-10-01), Yoshida et al.
patent: 5847446 (1998-12-01), Park et al.
patent: 5940277 (1999-08-01), Farnworth et al.
Park Sang Wook
Park Sung Bum
Hyundai Electronics Industries Co,. Ltd.
Lin Yung A.
Wilczewski Mary
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