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Via density rules

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Via electromigration improvement by changing the via bottom...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via filled dual damascene structure with middle stop layer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via filled dual damascene structure with middle stop layer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via formation for damascene metal conductors in an...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via formation in a poly(arylene ether) inter metal...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via formation using oxide reduction of underlying copper

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via gouging methods and related semiconductor structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via hole and trench structures and fabrication methods...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Via hole forming method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via hole profile and method of fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Via including multiple electrical paths

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via interconnect forming process and electronic component...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via masked line first dual damascene

Semiconductor device manufacturing: process – Chemical etching
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Via patterning for poly(arylene ether) used as an inter-metal di

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent

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Via plug formation in dual damascene process

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps
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Via RC improvement for copper damascene and beyond technology

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Via reactive ion etching process

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Via structure and method of manufacture

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Via structure using a composite dielectric layer

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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